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  1. Microelectronic Packaging

    MillPack is a provider of engineering services targeting CAD layout of multi-chip modules, semiconductor packaging and high-density printed circuit boards.
    bga design0
    chip-scale package0
    flex-circuit0

    www.millpack.com - 2009-02-12
  2. Tandex tests electronic devices for Military, Aerospace, Defense - Detect counterfeit parts

    Testing services,counterfeit detection of semiconductors. Biomedical testing on semiconductors and electronic component processing and packaging,destructive ...

    www.tandexlabs.com - 2009-02-12
  3. Metal Matrix Cast Composites

    Engineered metal matrix composites for reserch, industry and defense.
    aluminum graphite0
    CE alloys0
    composite alloys0
    graphite aluminum0
    graphite fiber composites0
    Metgraf0
    Metsic0

    www.mmccinc.com - 2009-02-07
  4. Manufacturer of high performance inks, pastes and custom dispersions: Five Star Technologies

    Five Star Technologies is a supplier of high performance inks, pastes and dispersions used in displays, photovoltaics and microelectronics packaging.
    conductive pastes0
    ElectroSperse inks0
    ElectroSperse pastes0
    fine line printability0
    linearization patterns0
    printable inks0

    www.fivestartech.com - 2009-02-07
  5. PRECISION GLASS WERKS

    Custom glass fabrication, Semiconductor, Motion Control, Encoders, Reticles, Photomasks, Wire Bonding, CNC machining, glass scribing, Laser cutting, micro ...
    pick and plate0
    Precision Glass Works0

    www.pgwerks.com - 2009-02-04
  6. Silicon Forest Patent Group - Patent protection for your technology

    Law firm specializing in patent and trademark application drafting and prosecution in the US Patent and Trademark Office. Emphasis on medical devices, ...
    Fordenbacher0

    www.siliconforestpatentgroup.com - 2009-02-08
  7. Fraunhofer IZM Assembly and Packaging Technologies for Microsystems

    The Fraunhofer IZM is one of the leading institutes for product-focused development of advanced packaging technologies for microelectronics and microsystems ...
    Board Interconnection0
    e-Grain0
    Fraunhofer IZM0
    Micromechanical Systems0
    Waferlevel0

    www.izm.fhg.de - 2009-01-28

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